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Quality And Transparency

Critical Chip Solutions

Quality And Transparency

Quality & Transparency are the cornerstone foundations of our business. We utilize a global network of independent Testing Laboratories accredited in accordance with ISO/IEC 17025:2017 & AS6171 Detection of Suspect/Counterfeit Parts.

Our team is committed to providing only the highest-quality components, verified directly by the manufacturer or by independent testing laboratories.

Prior to final shipment, our customers are able to approve all test reports, labels, and documentation. Furthermore, our commitment to quality is always backed by our 3-year warranty.

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Testing standards & requirements to support your specific needs

SAE AS5553 & AS5553A Aerospace Standards

IDEA-STD-1010, SAE AS6081, AS6496, AS6171, AS6174, MIL-STD-750, & MIL-STD-883

Access to GIDEP – the US Department of Defense Government-Industry Data Exchange Program.

Why Us

External Visual & Packaging Inspection

  • Documentation of labels and packaging
  • Solvent and surface testing
  • Mechanical Inspection – Dimensionality and lead condition
  • Condition • Weight Measurement

X-Ray Analysis

  • X-ray analysis is performed to verify that the internal package or die construction is consistent within the lot being inspected and versus datasheet and/or with a known authentic device of the same or proximate date and lot code as available.

DPA/Delid/Decapsulation

  • Delid/Decapsulation is a destructive test to expose the die, die circuitry, and interconnections for subsequent inspection using optical and electron microscopy to optically examine each die at a suitable magnification to help identify defective parts, counterfeit parts, or to aid in the identification of devices that exhibit anomalies.

XRF Analysis

  • X-Ray Fluorescence (XRF) is a fast and simple method to verify the materials and finishes of electronic components to compare with the original design and construction material requirements.
  • The most common application of this test is to validate the component’s RoHS status and compare it with OCM data. Any discrepancies will require further investigation to assess the risk of counterfeiting.

Electrical Testing

  • Curve Trace Testing
  • LCR Testing
  • Transistor Testing – MOSFET/Diode
  • Memory Testing
  • Functional Testing
  • Radio Frequency (RF) Testing
  • FPGA Speed Grade Test at Specified Temp.
  • And Many More….

Solderability Test

  • BGA Oven Reflow Tests
  • Wetting Balance

We specialize in delivering

We regularly source a wide range of products from leading manufacturers and approved vendors around the world. In total we can secure electronic components from over 500 manufacturers.
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With over 20 years of experience in the electronic component distribution industry, Critical Chip Solutions supplies the highest quality hard-to-find, end-of-life, obsolete, and long lead time electronic components.
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